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2010Vol.20,No.10199910CHINESEJOURNALOFSEMICONDUCTORSOct.,1999,1970,,,,,,1998209217,1999202211(200433)(117685)(flipchip).,,,.,.EEACC:0170J,0170L,0170N,7230G1.,,.(DIP),(QFP),[13].,.().,[4].,,,,,.,.,().(50150Lm),.,,.,,X.,,.,,..1106,.,[5][6]..2211,(37wt%Pb63wt%Sn)FR24..,.,,16.,,85,85%.,.10%.,800h,1000hGB4590284,1800h.,3.1,,,.,015Lm.,0105Lm.,400.2121.1106Lm,,,..70910:,111Lm,,1106111Lm,.,018214Lm.,,.,.,1125Lm,014Lm,..,:,.213,.,..,,.,,.,,.,,.,100kg.,.,,150,,.,,.3,,:311,,.,,.2(É),.,.2(a)(b).,.,,.80920,,.,.312,.,.3(É).3,.,.3,.,,.,,,.,,4(a)(É)..4(b)(É),.,,.,,,.,,,4(a)(b)(É).4,.,,.,.,.,,.[1]J.S.Osenbach,J.L.Zell,IEEETrans.Compon.HybridsManuf.Technol.,1993,16(3):350359.[2]Y.Koubuchi,J.Onuki,IEEETrans.Electron.Devices,1990,37(5):12591263[3],,,,,1998,19(9):702706.90910:[4]G.O’Malley,J.Giesler,S.Machuga,IEEETrans.Compon.Packag.Manuf.Technol.PartB,1994,17(3):248255.[5]M.K.Shell,S.Golwallaretal.,ApplicationofInfraredMicroscopyforBondPadDamageDetection,29thAn2nualProc.Int.Reliab.Phys.Symp.,NY,USA,1991:152159.[6]P.Alpern,R.Tilgner,IEEETrans.Compon.HybridsManuf.Technol.,1992,15(1):114117.InspectionofAluminumCorrosioninFlipChipbyIRMicroscopeLuJicun,ZongXiangfu(DepartmentofMaterialsScience,FudanUniversity,Shanghai200433)WuJianhua,LimThiamBeng(InstituteofMicroelectronics,Singapore117685)Received17September1998,revisedmanuscriptreceived11February1999AbstractFlipchipisoneofthehotresearchfieldsinelectronicpackaging.Inthispaper,wefirstlyreporttheIRmicroscopicinspectionforaluminumcorrosioninflipchipassem2bliesthathavebeensubjectedtotemperatureandhumiditytest.ToverifytheobservationbyIRmicroscope,adestructivefailureanalysismethodforaluminumcorrosiondetectionhasbeendeveloped.Ithasbeenfoundthatflipchipassemblieswithandwithoutunderfillinthisstudyhavedifferentaluminumcorrosionmodesandmechanism.EEACC:0170J,0170L,0170N,7230G01920:É2(a)()(b)3(a)()(b)4(a)()(b)
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本文标题：倒装芯片中铝腐蚀的红外显微镜观测研究
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